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CATEGORY 6 - SENSORS AND LASERS

 

CATEGORY 6 - SENSORS AND LASERS

6A Systems, Equipment and Components

6A001 Acoustic systems, equipment and components, as follows:

a. Marine acoustic systems, equipment and specially designed components therefor, as follows:

1. Active (transmitting or transmitting-and-receiving) systems, equipment and specially designed components therefor, as follows:

a. Acoustic seabed survey equipment as follows:

1. Surface vessel survey equipment designed for seabed topographic mapping and having all of the following:

a. Designed to take measurements at an angle exceeding 20° from the vertical;

b. Designed to measure seabed topography at seabed depths exceeding 600 m;

c. Sounding resolution' less than 2; and

d. Enhancement' of the depth accuracy through compensation for all the following:

1. Motion of the acoustic sensor;

2. In-water propagation from sensor to the seabed and back;

3. Sound speed at the sensor;

2. Underwater survey equipment designed for seabed topographic mapping and having any of the following:

a. Having all of the following: 1. Designed or modified to operate at depths exceeding 300 m; and 2. 'Sounding rate' greater than 3 800 m/s; or

b. Survey equipment, not specified in 6A001.a.1.a.2.a., having all of the following:

1. Designed or modified to operate at depths exceeding 100 m;

2. Designed to take measurements at an angle exceeding 20° from the vertical;

3. Having any of the following:

a. Operating frequency below 350 kHz; or

b. Designed to measure seabed topography at a range exceeding 200 m from the acoustic sensor; and

4. Enhancement' of the depth accuracy through compensation of all of the following:

a. Motion of the acoustic sensor;

b. In-water propagation from sensor to the seabed and back; and

c. Sound speed at the sensor;

3. Side Scan Sonar (SSS) or Synthetic Aperture Sonar (SAS), designed for seabed imaging and having all of the following, and specially designed transmitting and receiving acoustic arrays therefor;

a. Designed or modified to operate at depths exceeding 500 m;

b. An 'area coverage rate' of greater than 570 m2/s while operating at the maximum range that it can operate with an 'along track resolution' of less than 15 cm; and

c. An 'across track resolution' of less than 15 cm;

b. Systems or transmitting and receiving arrays, designed for object detection or location, having any of the following:

1. A transmitting frequency below 10 kHz;

2. Sound pressure level exceeding 224 dB (reference 1 μPa at 1 m) for equipment with an operating frequency in the band from 10 kHz to 24 kHz inclusive;

3. Sound pressure level exceeding 235 dB (reference 1 μPa at 1 m) for equipment with an operating frequency in the band between 24 kHz and 30 kHz;

4. Forming beams of less than 1° on any axis and having an operating frequency of less than 100 kHz;

5. Designed to operate with an unambiguous display range exceeding 5 120 m; or

6. Designed to withstand pressure during normal operation at depths exceeding 1 000 m and having transducers with any of the following:

a. Dynamic compensation for pressure; or

b. Incorporating other than lead zirconate titanate as the transduction element;

c. Acoustic projectors, including transducers, incorporating piezoelectric, magnetostrictive, electrostrictive, electrodynamic or hydraulic elements operating individually or in a designed combination and having any of the following:

1. Operating at frequencies below 10 kHz and having any of the following:

a. Not designed for continuous operation at 100% duty cycle and having a radiated 'free-field Source Level (SLRMS)' exceeding (10log(f) + 169,77) dB (reference 1 µPa at 1 m) where f is the frequency in Hertz of maximum Transmitting Voltage Response (TVR) below 10kHz; or

b. Designed for continuous operation at 100% duty cycle and having a continuously radiated 'free-field Source Level (SLRMS)' at 100% duty cycle exceeding (10log(f) + 159,77) dB (reference 1 µPa at 1 m) where f is the frequency in Hertz of maximum Transmitting Voltage Response (TVR) below 10kHz; or

2. Not used

3. Side-lobe suppression exceeding 22 dB;

d. Acoustic systems and equipment, designed to determine the position of surface vessels or underwater vehicles and having all the following, and specially designed components therefor:

1. Detection range exceeding 1 000 m; and

2. Determined position error of less than 10 m rms (root mean square) when measured at a range of 1 000 m;

e. Active individual sonars, specially designed or modified to detect, locate and automatically classify swimmers or divers, having all of the following, and specially designed transmitting and receiving acoustic arrays therefor:

1. Detection range exceeding 530 m;

2. Determined position error of less than 15 m rms (root mean square) when measured at a range of 530 m; and

3. Transmitted pulse signal bandwidth exceeding 3 kHz;

2. Passive systems, equipment and specially designed components therefor, as follows:

a. Hydrophones having any of the following:

1. Incorporating continuous flexible sensing elements;

2. Incorporating flexible assemblies of discrete sensing elements with either a diameter or length less than 20 mm and with a separation between elements of less than 20 mm;

3. Having any of the following sensing elements:

a. Optical fibres;

b. Piezoelectric polymer films' other than polyvinylidene-fluoride (PVDF) and its co-polymers {P(VDF-TrFE) and P(VDF-TFE)}; or

c. Flexible piezoelectric composites';

d. Lead-magnesium-niobate/lead-titanate (i.e., Pb(Mg1/3Nb2/3)O3-PbTiO3, or PMN-PT) piezoelectric single crystals grown from solid solution; or

e. Lead-indium-niobate/lead-magnesium niobate/lead-titanate (i.e., Pb(In1/2Nb1/2)O3–Pb(Mg1/3Nb2/3)O3–PbTiO3, or PINPMN-PT) piezoelectric single crystals grown from solid solution;

4. A 'hydrophone sensitivity' better than -180 dB at any depth with no acceleration compensation;

5. Designed to operate at depths exceeding 35 m with acceleration compensation; or

6. Designed for operation at depths exceeding 1000 m;

b. Towed acoustic hydrophone arrays having any of the following:

1. Hydrophone group spacing of less than 12,5 m or 'able to be modified' to have hydrophone group spacing of less than 12,5 m;

2. Designed or 'able to be modified' to operate at depths exceeding 35 m;

3. Heading sensors specified in 6A001.a.2.d.;

4. Longitudinally reinforced array hoses;

5. An assembled array of less than 40 mm in diameter; or

6. Not used;

7. Hydrophone characteristics specified in 6A001.a.2.a.; or

8. Accelerometer-based hydro-acoustic sensors specified in 6A001.a.2.g.;

c. Processing equipment, specially designed for towed acoustic hydrophone arrays, having "user accessible programmability" and time or frequency domain processing and correlation, including spectral analysis, digital filtering and beamforming using Fast Fourier or other transforms or processes;

d. Heading sensors having all of the following:

1. An "accuracy" of better than 0,5°; and

2. Designed to operate at depths exceeding 35 m or having an adjustable or removable depth sensing device in order to operate at depths exceeding 35 m;

e. Bottom or bay cable systems, having any of the following:

1. Incorporating hydrophones specified in 6A001.a.2.a.;

2. Incorporating multiplexed hydrophone group signal modules having all of the following characteristics:

a. Designed to operate at depths exceeding 35 m or having an adjustable or removable depth sensing device in order to operate at depths exceeding 35 m; and

b. Capable of being operationally interchanged with towed acoustic hydrophone array modules; or

3. Incorporating accelerometer-based hydro-acoustic sensors specified in 6A001.a.2.g.;

f. Processing equipment, specially designed for bottom or bay cable systems, having "user accessible programmability" and time or frequency domain processing and correlation, including spectral analysis, digital filtering and beamforming using Fast Fourier or other transforms or processes;

g. Accelerometer-based hydro-acoustic sensors having all of the following:

1. Composed of three accelerometers arranged along three distinct axes;

2. Having an overall 'acceleration sensitivity' better than 48 dB (reference 1 000 mV rms per 1g);

3. Designed to operate at depths greater than 35 meters; and

4. Operating frequency below 20 kHz.

b. Correlation-velocity and Doppler-velocity sonar log equipment, designed to measure the horizontal speed of the equipment carrier relative to the sea bed, as follows:

1. Correlation-velocity sonar log equipment having any of the following characteristics:

a. Designed to operate at distances between the carrier and the sea bed exceeding 500 m; or

b. Having speed "accuracy" better than 1% of speed;

2. Doppler-velocity sonar log equipment having speed "accuracy" better than 1% of speed.

c. Not used.

6A002 Optical sensors or equipment and components therefor, as follows:

a. Optical detectors as follows:

1. "Space-qualified" solid-state detectors as follows:

a. "Space-qualified" solid-state detectors having all of the following:

1. A peak response in the wavelength range exceeding 10 nm but not exceeding 300 nm; and

2. A response of less than 0,1 % relative to the peak response at a wavelength exceeding 400 nm;

b. "Space-qualified" solid-state detectors having all of the following:

1. A peak response in the wavelength range exceeding 900 nm but not exceeding 1200 nm; and

2. A response "time constant" of 95 ns or less;

c. "Space-qualified" solid-state detectors having a peak response in the wavelength range exceeding 1200 nm but not exceeding 30000 nm;

d. "Space-qualified" "focal plane arrays" having more than 2048 elements per array and having a peak response in the wavelength range exceeding 300 nm but not exceeding 900 nm.

2. Image intensifier tubes and specially designed components therefor, as follows:

a. Image intensifier tubes having all of the following:

1. A peak response in the wavelength range exceeding 400 nm but not exceeding 1050 nm;

2. Electron image amplification using any of the following:

a. A microchannel plate with a hole pitch (centre-to-centre spacing) of 12 μm or less; or

b. An electron sensing device with a non-binned pixel pitch of 500 µm or less, specially designed or modified to achieve 'charge multiplication' other than by a microchannel plate; and

3. Any of the following photocathodes:

a. Multialkali photocathodes (e.g., S-20 and S-25) having a luminous sensitivity exceeding 350 µA/lm;

b. GaAs or GaInAs photocathodes; or

c. Other “III/V compound” semiconductor photocathodes having a maximum “radiant sensitivity” exceeding 10 mA/W;

b. Image intensifier tubes having all of the following:

1. A peak response in the wavelength range exceeding 1050 nm but not exceeding 1800 nm;

2. Electron image amplification using any of the following:

a. A microchannel plate with a hole pitch (centre-to-centre spacing) of 12 µm or less; or

b. An electron sensing device with a non-binned pixel pitch of 500 µm or less, specially designed or modified to achieve 'charge multiplication' other than by a microchannel plate; and

3. “III/V compound” semiconductor (e.g. GaAs or GaInAs) photocathodes and transferred electron photocathodes, having a maximum “radiant sensitivity” exceeding 15 mA/W;

c. Specially designed components as follows:

1. Microchannel plates having a hole pitch (centre-to-centre spacing) of 12 µm or less;

2. An electron sensing device with a non-binned pixel pitch of 500 µm or less, specially designed or modified to achieve 'charge multiplication' other than by a microchannel plate;

3. "III/V compound" semiconductor (e.g., GaAs or GaInAs) photocathodes and transferred electron photocathodes;

3. Non-"space-qualified" "focal plane arrays" as follows:

a. Non-"space-qualified" "focal plane arrays" having all of the following:

1. Individual elements with a peak response within the wavelength range exceeding 900 nm but not exceeding 1050 nm; and

2. Any of the following:

a. A response "time constant" of less than 0,5 ns; or

b. Specially designed or modified to achieve 'charge multiplication' and having a maximum "radiant sensitivity" exceeding 10 mA/W;

b. Non-"space-qualified" "focal plane arrays" having all of the following:

1. Individual elements with a peak response in the wavelength range exceeding 1050 nm but not exceeding 1200 nm; and

2. Any of the following:

a. A response "time constant" of 95 ns or less; or

b. Specially designed or modified to achieve 'charge multiplication' and having a maximum radiant sensitivity exceeding 10 mA/W;

c. Non-"space-qualified" non-linear (2-dimensional) "focal plane arrays" having individual elements with a peak response in the wavelength range exceeding 1200 nm but not exceeding 30000 nm;

d. Non-"space-qualified" linear (1-dimensional) "focal plane arrays" having all of the following:

1. Individual elements with a peak response in the wavelength range exceeding 1200 nm but not exceeding 3000 nm; and

2. Any of the following:

a. A ratio of 'scan direction' dimension of the detector element to the 'cross-scan direction' dimension of the detector element of less than 3,8; or

b. Signal Processing In The Element (SPRITE);

e. Non-"space-qualified" linear (1-dimensional) "focal plane arrays" having individual elements with a peak response in the wavelength range exceeding 3000 nm but not exceeding 30000 nm;

f. Non-"space-qualified" non-linear (2-dimensional) infrared "focal plane arrays" based on 'microbolometer' material having individual elements with an unfiltered response in the wavelength range equal to or exceeding 8000 nm but not exceeding 14000 nm;

g. Non-"space-qualified" "focal plane arrays" having all of the following:

1. Individual detector elements with a peak response in the wavelength range exceeding 400 nm but not exceeding 900 nm;

2. Specially designed or modified to achieve 'charge multiplication' and having a maximum "radiant sensitivity" exceeding 10 mA/W for wavelengths exceeding 760 nm; and

3. Greater than 32 elements.

b. "Monospectral imaging sensors" and "multispectral imaging sensors", designed for remote sensing applications and having any of the following:

1. An Instantaneous-Field-Of-View (IFOV) of less than 200 µrad (microradians); or

2. Specified for operation in the wavelength range exceeding 400 nm but not exceeding 30000 nm and having all the following;

a. Providing output imaging data in digital format; and

b. Having any of the following characteristics:

1. "Space-qualified"; or

2. Designed for airborne operation, using other than silicon detectors, and having an IFOV of less than 2,5 mrad (milliradians);

c. Direct view' imaging equipment incorporating any of the following:

1. Image intensifier tubes specified in 6A002.a.2.a. or 6A002.a.2.b.;

2. “Focal plane arrays” specified in 6A002.a.3.; or

3. Solid state detectors specified in 6A002.a.1.;

d. Special support components for optical sensors, as follows:

1. "Space-qualified" cryocoolers;

2. Non-"space-qualified" cryocoolers having a cooling source temperature below 218 K (-55 °C), as follows:

a. Closed cycle type with a specified Mean-Time-To-Failure (MTTF) or Mean-Time-Between-Failures (MTBF), exceeding 2500 hours;

b. Joule-Thomson (JT) self-regulating minicoolers having bore (outside) diameters of less than 8 mm;

3. Optical sensing fibres specially fabricated either compositionally or structurally, or modified by coating, to be acoustically, thermally, inertially, electromagnetically or nuclear radiation sensitive;

e. Not used.

6A003 Cameras, systems or equipment, and components therefor, as follows:

a. Instrumentation cameras and specially designed components therefor, as follows:

1. High-speed cinema recording cameras using any film format from 8 mm to 16 mm inclusive, in which the film is continuously advanced throughout the recording period, and that are capable of recording at framing rates exceeding 13 150 frames/s;

2. Mechanical high speed cameras, in which the film does not move, capable of recording at rates exceeding 1000000 frames/s for the full framing height of 35 mm film, or at proportionately higher rates for lesser frame heights, or at proportionately lower rates for greater frame heights;

3. Mechanical or electronic streak cameras, as follows:

a. Mechanical or electronic streak cameras, having writing speeds exceeding 10 mm/µs;

b. Electronic streak cameras having temporal resolution better than 50 ns;

4. Electronic framing cameras having a speed exceeding 1000000 frames/s;

5. Electronic cameras having all of the following:

a. An electronic shutter speed (gating capability) of less than 1 µs per full frame; and

b. A read out time allowing a framing rate of more than 125 full frames per second;

6. Plug-ins having all of the following characteristics:

a. Specially designed for instrumentation cameras which have modular structures and which are specified in 6A003.a.; and

b. Enabling these cameras to meet the characteristics specified in 6A003.a.3., 6A003.a.4., or 6A003.a.5., according to the manufacturer's specifications;

b. Imaging cameras as follows:

1. Video cameras incorporating solid state sensors, having a peak response in the wavelength range exceeding 10 nm, but not exceeding 30000 nm and having all of the following:

a. Having any of the following:

1. More than 4 × 10E6 "active pixels" per solid state array for monochrome (black and white) cameras;

2. More than 4 × 10E6 "active pixels" per solid state array for colour cameras incorporating three solid state arrays; or

3. More than 12 × 10E6 "active pixels" for solid state array colour cameras incorporating one solid state array; and

b. Having any of the following:

1. Optical mirrors specified in 6A004.a.;

2. Optical control equipment specified in 6A004.d.; or

3. The capability for annotating internally generated 'camera tracking data';

2. Scanning cameras and scanning camera systems, having all of the following:

a. A peak response in the wavelength range exceeding 10 nm, but not exceeding 30000 nm;

b. Linear detector arrays with more than 8192 elements per array; and

c. Mechanical scanning in one direction;

3. Imaging cameras incorporating image intensifier tubes specified in 6A002.a.2.a. or 6A002.a.2.b.;

4. Imaging cameras incorporating “focal plane arrays” having any of the following:

a. Incorporating "focal plane arrays" specified in 6A002.a.3.a. to 6A002.a.3.e.;

b. Incorporating "focal plane arrays" specified in 6A002.a.3.f.; or

c. Incorporating "focal plane arrays" specified in 6A002.a.3.g.;

5. Imaging cameras incorporating solid-state detectors specified in 6A002.a.1.

6A004 Optical equipment and components, as follows:

a. Optical mirrors (reflectors) as follows:

1. "Deformable mirrors" having an active optical aperture greater than 10 mm and having any of the following,, and specially designed components therefor,

a. Having all the following:

1. A mechanical resonant frequency of 750 Hz or more; and

2. More than 200 actuators; or

b. A Laser Induced Damage Threshold (LIDT) being any of the following:

1. Greater than 1 kW/ cm2 using a "CW laser"; or

2. Greater than 2 J/ cm2 using 20 ns "laser" pulses at 20 Hz repetition rate;

2. Lightweight monolithic mirrors having an average "equivalent density" of less than 30 kg/m² and a total mass exceeding 10 kg;

3. Lightweight "composite" or foam mirror structures having an average "equivalent density" of less than 30 kg/m² and a total mass exceeding 2 kg;

4. Mirrors specially designed for beam steering mirror stages specified in 6A004.d.2.a. with a flatness of λ/10 or better (λ is equal to 633 nm)and having any of the following

a. Diameter or major axis length greater than or equal to 100 mm; or

b. Having all of the following:

1. Diameter or major axis length greater than 50 mm but less than 100 mm; and

2. A Laser Induced Damage Threshold (LIDT) being any of the following:

a. Greater than 10 kW/cm2 using a "CW laser"; or

b. Greater than 20 J/cm2 using 20 ns "laser" pulses at 20 Hz repetition rate;

b. Optical components made from zinc selenide (ZnSe) or zinc sulphide (ZnS) with transmission in the wavelength range exceeding 3000 nm but not exceeding 25000 nm and having any of the following:

1. Exceeding 100 cm³ in volume; or

2. Exceeding 80 mm in diameter or length of major axis and 20 mm in thickness (depth);

c. "Space-qualified" components for optical systems, as follows:

1. Components lightweighted to less than 20 % "equivalent density" compared with a solid blank of the same aperture and thickness;

2. Raw substrates, processed substrates having surface coatings (single-layer or multi-layer, metallic or dielectric, conducting, semiconducting or insulating) or having protective films;

3. Segments or assemblies of mirrors designed to be assembled in space into an optical system with a collecting aperture equivalent to or larger than a single optic 1 m in diameter;

4. Components manufactured from "composite" materials having a coefficient of linear thermal expansion equal to or less than 5 × 10E-6 in any coordinate direction;

d. Optical control equipment as follows:

1. Equipment specially designed to maintain the surface figure or orientation of the "space-qualified" components specified in 6A004.c.1. or 6A004.c.3.;

2. Steering, tracking, stabilisation and resonator alignment equipment as follows:

a. Beam steering mirror stages designed to carry mirrors having diameter or major axis length greater than 50 mm and having all of the following, and specially designed electronic control equipment therefor:

1. A maximum angular travel of ±26 mrad or more;

2. A mechanical resonant frequency of 500 Hz or more; and

3. An angular "accuracy" of 10 μrad (microradians) or less (better);

b. Resonator alignment equipment having bandwidths equal to or more than 100 Hz and an "accuracy" of 10 μrad or less (better);

3. Gimbals having all of the following:

a. A maximum slew exceeding 5°;

b. A bandwidth of 100 Hz or more;

c. Angular pointing errors of 200 µrad (microradians) or less; and

d. Having any of the following:

1. Exceeding 0,15 m but not exceeding 1 m in diameter or major axis length and capable of angular accelerations exceeding 2 rad (radians)/s²; or

2. Exceeding 1 m in diameter or major axis length and capable of angular accelerations exceeding 0,5 rad (radians)/s²;

4. Not used

e. Aspheric optical elements' having all of the following:

1. Largest dimension of the optical-aperture greater than 400 mm;

2. Surface roughness less than 1 nm (rms) for sampling lengths equal to or greater than 1 mm; and

3. Coefficient of linear thermal expansion's absolute magnitude less than 3 × 10E-6/K at 25 °C.

6A005 "Lasers", other than those specified in 0B001.g.5. or 0B001.h.6., components and optical equipment, as follows:

a. Non-"tunable" continuous wave "(CW) lasers" having any of the following:

1. Output wavelength less than 150 nm with an output power exceeding 1 W;

2. Output wavelength of 150 nm or more but not exceeding 510 nm and output power exceeding 30 W;

3. Output wavelength exceeding 510 nm but not exceeding 540 nm and any of the following:

a. Single transverse mode output and output power exceeding 50 W; or

b. Multiple transverse mode output and output power exceeding 150 W;

4. Output wavelength exceeding 540 nm but not exceeding 800 nm and having an output power exceeding 30 W;

5. Output wavelength exceeding 800 nm but not exceeding 975 nm and having any of the following:

a. Single transverse mode output having an output power exceeding 50 W; or

b. Multiple transverse mode output having an output power exceeding 80 W;

6. Output wavelength exceeding 975 nm but not exceeding 1 150 nm and any of the following:

a. Single transverse mode and output power exceeding 200 W; or

b. Multiple transverse mode output and any of the following:

1. Wall-plug efficiency' exceeding 18% and output power exceeding 500 W; or

2. Output power exceeding 2 kW;

7. Output wavelength exceeding 1 150 nm but not exceeding 1 555 nm and of the following:

a. Single transverse mode and output power exceeding 50 W; or

b. Multiple transverse mode and output power exceeding 80 W; or

8. Output wavelength exceeding 1 555 nm and output power exceeding 1 W;

b. Non-"tunable" "pulsed lasers" having any of the following:

1. Output wavelength less than 150 nm and any of the following:

a. Output energy exceeding 50 mJ per pulse and "peak power" exceeding 1 W; or

b. "Average output power" exceeding 1 W;

2. Output wavelength of 150 nm or more but not exceeding 510 nm and any of the following:

a. Output energy exceeding 1,5 J per pulse and "peak power" exceeding 30 W; or

b. "Average output power" exceeding 30 W;

3. Output wavelength exceeding 510 nm but not exceeding 540 nm and any of the following:

a. Single transverse mode output and any of the following:

1. Output energy exceeding 1,5 J per pulse and "peak power" exceeding 50 W; or

2. "Average output power" exceeding 50 W; or

b. Multiple transverse mode output and any of the following:

1. Output energy exceeding 1,5 J per pulse and "peak power" exceeding 150 W; or

2. "Average output power" exceeding 150 W;

4. Output wavelength exceeding 540 nm but not exceeding 800 nm and any of the following:

a. Output energy exceeding 1,5 J per pulse and "peak power" exceeding 30 W; or

1. Output energy exceeding 0,005 J per pulse and "peak power" exceeding 5 GW; or

2. "Average output power" exceeding 20 W; or

b. "Average output power" exceeding 30 W;

1. Output energy exceeding 1,5 J per pulse and "peak power" exceeding 30 W; or

2. "Average output power" exceeding 30 W;

5. Output wavelength exceeding 800 nm but not exceeding 975 nm and any of the following:

a. "Pulse duration" less than 1 ps and any of the following:

1. Output energy exceeding 0,005 J per pulse and "peak power" exceeding 5 GW; or

2. Single transverse mode output and "average output power" exceeding 20 W;

b. "Pulse duration" equal to or exceeding 1 ps and not exceeding 1 µs and any of the following:

1. Output energy exceeding 0,5 J per pulse and "peak power" exceeding 50 W;

2. Single transverse mode output and "average output power" exceeding 20 W; or

3. Multiple transverse mode output and "average output power" exceeding 50 W; or

c. "Pulse duration" exceeding 1 µs and any of the following:

1. Output energy exceeding 2 J per pulse and "peak power" exceeding 50 W;

2. Single transverse mode output and "average output power" exceeding 50 W; or

3. Multiple transverse mode output and "average output power" exceeding 80 W;

6. Output wavelength exceeding 975 nm but not exceeding 1 150 nm and any of the following:

a. "Pulse duration" of less than 1 ns and any of the following:

1. Output "peak power" exceeding 2 GW per pulse;

2. "Average output power" exceeding 30 W; or

3. Output energy exceeding 0,002 J per pulse;

b. "Pulse duration" equal to or exceeding 1 ps and less than 1 ns and any of the following:

1. Output "peak power" exceeding 5 GW per pulse;

2. "Average output power" exceeding 50 W; or

3. Output energy exceeding 0,1 J per pulse;

c. "Pulse duration" equal to or exceeding 1 ns but not exceeding 1 µs, and any of the following:

1. Single transverse mode output and any of the following:

a. "Peak power" exceeding 100 MW;

b. "Average output power" exceeding 20 W limited by design to a maximum pulse repetition frequency less than or equal to 1 kHz;

c. Wall-plug efficiency' exceeding 12%, "average output power" exceeding 100 W and capable of operating at a pulse repetition frequency greater than 1 kHz;

d. "Average output power" exceeding 150 W and capable of operating at a pulse repetition frequency greater than 1 kHz; or

e. Output energy exceeding 2 J per pulse; or

2. Multiple transverse mode output and any of the following:

a. "Peak power" exceeding 400 MW;

b. Wall-plug efficiency' exceeding 18% and "average output power" exceeding 500 W;

c. "Average output power" exceeding 2 kW; or

d. Output energy exceeding 4 J per pulse; or

d. "Pulse duration" exceeding 1 µs and any of the following:

1. Single transverse mode output and any of the following:

a. "Peak power" exceeding 500 kW;

b. Wall-plug efficiency' exceeding 12% and "average output power" exceeding 100 W; or

c. "Average output power" exceeding 150 W; or

2. Multiple transverse mode output and any of the following:

a. "Peak power" exceeding 1 MW;

b. Wall-plug efficiency' exceeding 18% and "average output power" exceeding 500 W; or

c. "Average output power" exceeding 2 kW;

7. Output wavelength exceeding 1150 nm but not exceeding 1555 nm, and any of the following:

a. "Pulse duration" not exceeding 1 µs and any of the following:

1. Output energy exceeding 0,5 J per pulse and "peak power" exceeding 50 W;

2. Single transverse mode output and "average output power" exceeding 20 W; or

3. Multiple transverse mode output and "average output power" exceeding 50 W; or

b. "Pulse duration" exceeding 1 µs and any of the following:

1. Output energy exceeding 2 J per pulse and "peak power" exceeding 50 W;

2. Single transverse mode output and "average output power" exceeding 50 W; or

3. Multiple transverse mode output and "average output power" exceeding 80 W; or

8. Output wavelength exceeding 1555 nm and any of the following:

a. Output energy exceeding 100 mJ per pulse and "peak power" exceeding 1 W; or

b. "Average output power" exceeding 1 W;

c. "Tunable" "lasers" having any of the following:

1. Output wavelength less than 600 nm and having any of the following:

a. Output energy exceeding 50 mJ per pulse and "peak power" exceeding 1 W; or

b. Average or CW output power exceeding 1 W;

2. Output wavelength of 600 nm or more but not exceeding 1400 nm and having any of the following:

a. Output energy exceeding 1 J per pulse and "peak power" exceeding 20 W; or

b. Average or CW output power exceeding 20 W; or

3. Output wavelength exceeding 1400 nm and having any of the following:

a. Output energy exceeding 50 mJ per pulse and "peak power" exceeding 1 W; or

b. Average or CW output power exceeding 1 W;

d. Other "lasers", not specified in 6A005.a., 6A005.b. or 6A005.c. as follows:

1. Semiconductor "lasers" as follows:

a. Individual single-transverse mode semiconductor "lasers" having any of the following:

1. Wavelength equal to or less than 1510 nm and average or CW output power, exceeding 1,5 W; or

2. Wavelength greater than 1510 nm and average or CW output power, exceeding 500 mW;

b. Individual, multiple-transverse mode semiconductor "lasers" having any of the following:

1. Wavelength of less than 1400 nm and average or CW output power, exceeding 15 W;

2. Wavelength equal to or greater than 1400 nm and less than 1900 nm and average or CW output power, exceeding 2,5 W; or

3. Wavelength equal to or greater than 1900 nm and average or CW output power, exceeding 1 W;

c. Individual semiconductor “laser” ‘bars’, having any of the following:

1. Wavelength of less than 1400 nm and average or CW output power, exceeding 100 W;

2. Wavelength equal to or greater than 1400 nm and less than 1900 nm and average or CW output power, exceeding 25 W; or

3. Wavelength equal to or greater than 1900 nm and average or CW output power, exceeding 10 W;

d. Semiconductor “laser” ‘stacked arrays’ (two-dimensional arrays) having any of the following:

1. Wavelength less than 1400 nm and having any of the following:

a. Average or CW total output power less than 3 kW and having average or CW output ‘power density’ greater than 500 W/cm² ;

b. Average or CW total output power equal to or exceeding 3 kW but less than or equal to 5 kW, and having average or CW output ‘power density’ greater than 350 W/cm²;

c. Average or CW total output power exceeding 5 kW;

d. Peak pulsed ‘power density’ exceeding 2 500 W/cm² ; or

e. Spatially coherent average or CW total output power, greater than 150 W;

2. Wavelength greater than or equal to 1400 nm but less than 1900 nm, and having any of the following:

a. Average or CW total output power less than 250 W and average or CW output ‘power density’ greater than 150 W/cm² ;

b. Average or CW total output power equal to or exceeding 250 W but less than or equal to 500 W, and having average or CW output ‘power density’ greater than 50 W/cm² ;

c. Average or CW total output power exceeding 500 W;

d. Peak pulsed ‘power density’ exceeding 500 W/cm² ; or

e. Spatially coherent average or CW total output power, exceeding 15 W;

3. Wavelength greater than or equal to 1900 nm and having any of the following:

a. Average or CW output ‘power density’ greater than 50 W/²cm ;

b. Average or CW output power greater than 10 W; or

c. Spatially coherent average or CW total output power, exceeding 1,5 W; or

4. At least one “laser” ‘bar’ specified in 6A005.d.1.c.;

e. Semiconductor “laser” ‘stacked arrays’, other than those specified in 6A005.d.1.d., having all of the following:

1. Specially designed or modified to be combined with other ‘stacked arrays’ to form a larger ‘stacked array’; and

2. Integrated connections, common for both electronics and cooling;

2. Carbon monoxide (CO) "lasers" having any of the following:

a. Output energy exceeding 2 J per pulse and "peak power" exceeding 5 kW; or

b. Average or CW output power exceeding 5 kW;

3. Carbon dioxide (CO2) "lasers" having any of the following:

a. CW output power exceeding 15 kW;

b. Pulsed output with a "pulse duration" exceeding 10 µs and any of the following:

1. "Average output power" exceeding 10 kW; or

2. "Peak power" exceeding 100 kW; or

c. Pulsed output with a "pulse duration" equal to or less than 10 µs and any of the following:

1. Pulse energy exceeding 5 J per pulse; or

2. "Average output power" exceeding 2,5 kW;

4. Excimer "lasers" having any of the following:

a. Output wavelength not exceeding 150 nm and any of the following:

1. Output energy exceeding 50 mJ per pulse; or

2. "Average output power" exceeding 1 W;

b. Output wavelength exceeding 150 nm but not exceeding 190 nm and any of the following:

1. Output energy exceeding 1,5 J per pulse; or

2. "Average output power" exceeding 120 W;

c. Output wavelength exceeding 190 nm but not exceeding 360 nm and any of the following:

1. Output energy exceeding 10 J per pulse; or

2. "Average output power" exceeding 500 W; or

d. Output wavelength exceeding 360 nm and any of the following:

1. Output energy exceeding 1,5 J per pulse; or

2. "Average output power" exceeding 30 W;

5. "Chemical lasers" as follows:

a. Hydrogen Fluoride (HF) "lasers";

b. Deuterium Fluoride (DF) "lasers";

c. "Transfer lasers" as follows:

1. Oxygen Iodine (O2-I) "lasers";

2. Deuterium Fluoride-Carbon dioxide (DF-CO2) "lasers";

6. Non-repetitive pulsed' Nd: glass "lasers" having any of the following:

a. "Pulse duration" not exceeding 1 µs and output energy exceeding 50 J per pulse; or

b. "Pulse duration" exceeding 1 µs and output energy exceeding 100 J per pulse;

e. Components as follows:

1. Mirrors cooled either by 'active cooling' or by heat pipe cooling;

2. Optical mirrors or transmissive or partially transmissive optical or electro-optical components, other than fused tapered fibre combiners and Multi-Layer Dielectric gratings (MLDs), specially designed for use with specified "lasers";

3. Fibre "laser" components as follows:

a. Multimode to multimode fused tapered fibre combiners having all of the following:

1. An insertion loss better (less) than or equal to 0,3 dB maintained at a rated total average or CW output power (excluding output power transmitted through the single mode core if present) exceeding 1 000 W; and

2. Number of input fibres equal to or greater than 3;

b. Single mode to multimode fused tapered fibre combiners having all of the following:

1. An insertion loss better (less) than 0,5 dB maintained at a rated total average or CW output power exceeding 4 600 W;

2. Number of input fibres equal to or greater than 3; and

3. Having any of the following:

a. A Beam Parameter Product (BPP) measured at the output not exceeding 1,5 mm mrad for a number of input fibres less than or equal to 5; or

b. A BPP measured at the output not exceeding 2,5 mm mrad for a number of input fibres greater than 5;

c. MLDs having all of the following:

1. Designed for spectral or coherent beam combination of 5 or more fibre "lasers"; and

2. CW "Laser" Induced Damage Threshold (LIDT) greater than or equal to 10 kW/cm2.

f. Optical equipment as follows:

1. Dynamic wavefront (phase) measuring equipment capable of mapping at least 50 positions on a beam wavefront and any of the following:

a. Frame rates equal to or more than 100 Hz and phase discrimination of at least 5 % of the beam's wavelength; or

b. Frame rates equal to or more than 1000 Hz and phase discrimination of at least 20 % of the beam's wavelength;

2. "Laser" diagnostic equipment capable of measuring "SHPL" system angular beam steering errors of equal to or less than 10 µrad;

3. Optical equipment and components, specially designed for a phased-array "SHPL" system for coherent beam combination to an "accuracy" of λ/10 at the designed wavelength, or 0,1 µm, whichever is the smaller;

4. Projection telescopes specially designed for use with "SHPL" systems.

g. ‘Laser acoustic detection equipment’ having all of the following:

1. CW "laser" output power equal to or exceeding 20 mW;

2. "Laser" frequency stability equal to or better (less) than 10 MHz;

3. "Laser" wavelengths equal to or exceeding 1 000 nm but not exceeding 2 000 nm;

4. Optical system resolution better (less) than 1 nm; and

5. Optical Signal to Noise ratio equal to or exceeding 103.

6A006 "Magnetometers", "magnetic gradiometers", "intrinsic magnetic gradiometers", underwater electric field sensors, "compensation systems", and specially designed components therefor, as follows:

a. "Magnetometers" and subsystems as follows:

1. "Magnetometers" using "superconductive" (SQUID) "technology" and having any of the following:

a. SQUID systems designed for stationary operation, without specially designed subsystems designed to reduce in-motion noise, and having a 'sensitivity' equal to or lower (better) than 50 fT (rms) per square root Hz at a frequency of 1 Hz; or

b. SQUID systems having an in-motion-magnetometer 'sensitivity' lower (better) than 20 pT (rms) per square root Hz at a frequency of 1 Hz and specially designed to reduce in-motion noise;

2. "Magnetometers" using optically pumped or nuclear precession (proton/Overhauser) "technology" having a 'sensitivity' lower (better) than 20 pT (rms) per square root Hz at a frequency of 1 Hz;

3. "Magnetometers" using fluxgate "technology" having a 'sensitivity' equal to or lower (better) than 10 pT (rms) per square root Hz at a frequency of 1 Hz;

4. Induction coil "magnetometers" having a 'sensitivity' lower (better) than any of the following:

a. 0,05 nT (rms) per square root Hz at frequencies of less than 1 Hz;

b. 1 × 10E-3 nT (rms) per square root Hz at frequencies of 1 Hz or more but not exceeding 10 Hz; or

c. 1 × 10E-4 nT (rms) per square root Hz at frequencies exceeding 10 Hz;

5. Fibre optic "magnetometers" having a 'sensitivity' lower (better) than 1 nT (rms) per square root Hz;

b. Underwater electric field sensors having a 'sensitivity' lower (better) than 8 nanovolt per metre per square root Hz when measured at 1 Hz;

c. "Magnetic gradiometers" as follows:

1. "Magnetic gradiometers" using multiple "magnetometers" specified in 6A006.a.;

2. Fibre optic "intrinsic magnetic gradiometers" having a magnetic gradient field 'sensitivity' lower (better) than 0,3 nT/m rms per square root Hz;

3. "Intrinsic magnetic gradiometers", using "technology" other than fibre-optic "technology", having a magnetic gradient field 'sensitivity' lower (better) than 0,015 nT/m rms per square root Hz;

d. "Compensation systems" for magnetic or underwater electric field sensors resulting in a performance equal to or better than the specified parameters of 6A006.a., 6A006.b. or 6A006.c.

e. Underwater electromagnetic receivers incorporating magnetic field sensors specified by 6A006.a. or underwater electric field sensors specified by 6A006.b.

6A007 Gravity meters (gravimeters) and gravity gradiometers, as follows:

a. Gravity meters designed or modified for ground use and having a static "accuracy" of less (better) than 10 µGal;

b. Gravity meters designed for mobile platforms and having all of the following:

1. A static "accuracy" of less (better) than 0,7 mGal; and

2. An in-service (operational) "accuracy" of less (better) than 0,7 mGal having a 'time-to-steady-state registration' of less than 2 minutes under any combination of attendant corrective compensations and motional influences;

c. Gravity gradiometers.

6A008 Radar systems, equipment and assemblies, having any of the following, and specially designed components therefor:

a. Operating at frequencies from 40 GHz to 230 GHz and having any of the following:

1. An average output power exceeding 100 mW; or

2. Locating "accuracy" of 1 m or less (better) in range and 0,2 degree or less (better) in azimuth;

b. A tunable bandwidth exceeding ±6,25 % of the 'centre operating frequency';

c. Capable of operating simultaneously on more than two carrier frequencies;

d. Capable of operating in synthetic aperture (SAR), inverse synthetic aperture (ISAR) radar mode, or sidelooking airborne (SLAR) radar mode;

e. Incorporating electronically steerable array antennae;

f. Capable of heightfinding non-cooperative targets;

g. Specially designed for airborne (balloon or airframe mounted) operation and having Doppler "signal processing" for the detection of moving targets;

h. Employing processing of radar signals and using any of the following:

1. "Radar spread spectrum" techniques; or

2. "Radar frequency agility" techniques;

i. Providing ground-based operation with a maximum "instrumented range" exceeding 185 km;

j. Being "laser" radar or Light Detection and Ranging (LIDAR) equipment and having any of the following:

1. "Space-qualified";

2. Employing coherent heterodyne or homodyne detection techniques and having an angular resolution of less (better) than 20 µrad (microradians); or

3. Designed for carrying out airborne bathymetric littoral surveys to International Hydrographic Organization (IHO) Order 1a Standard (5th Edition February 2008) for Hydrographic Surveys or better, and using one or more "lasers" with a wavelength exceeding 400 nm but not exceeding 600 nm;

k. Having "signal processing" sub-systems using "pulse compression" and having any of the following:

1. A "pulse compression" ratio exceeding 150; or

2. A compressed pulse width of less than 200 ns; or

l. Having data processing sub-systems and having any of the following:

1. "Automatic target tracking" providing, at any antenna rotation, the predicted target position beyond the time of the next antenna beam passage; or

2. Not used;

3. Not used;

4. Configured to provide superposition and correlation, or fusion, of target data within six seconds from two or more "geographically dispersed" radar sensors to improve the aggregate performance beyond that of any single sensor specified by 6A008.f. or 6A008.i.

6A102 Radiation hardened 'detectors', other than those specified in 6A002, specially designed or modified for protecting against nuclear effects (e.g. electromagnetic pulse (EMP), X-rays, combined blast and thermal effects) and usable for "missiles", designed or rated to withstand radiation levels which meet or exceed a total irradiation dose of 5 × 10E5 rads (silicon).

6A107 Gravity meters (gravimeters) and components for gravity meters and gravity gradiometers, as follows:

a. Gravity meters, other than those specified in 6A007.b, designed or modified for airborne or marine use, and having a static or operational accuracy equal to or less (better) than 0,7 milligal (mgal), and having a time-to-steady-state registration of two minutes or less;

b. Specially designed components for gravity meters specified in 6A007.b or 6A107.a. and gravity gradiometers specified in 6A007.c.

6A108 Radar systems and tracking systems, other than those specified in entry 6A008, as follows:

a. Radar and laser radar systems designed or modified for use in space launch vehicles specified in 9A004 or sounding rockets specified in 9A104;

b. Precision tracking systems, usable for "missiles", as follows:

1. Tracking systems which use a code translator in conjunction with either surface or airborne references or navigation satellite systems to provide real-time measurements of in-flight position and velocity;

2. Range instrumentation radars including associated optical/infrared trackers with all of the following capabilities:

a. Angular resolution better than 1,5 milliradians;

b. Range of 30 km or greater with a range resolution better than 10 m rms;

c. Velocity resolution better than 3 m/s.

6A202 Photomultiplier tubes having both of the following characteristics:

a. Photocathode area of greater than 20 cm²; and

b. Anode pulse rise time of less than 1 ns.

6A203 Cameras and components, other than those specified in 6A003, as follows:

a. Streak cameras, and specially designed components therefor, as follows:

1. Streak cameras with writing speeds greater than 0,5 mm/μs;

2. Electronic streak cameras capable of 50 ns or less time resolution;

3. Streak tubes for cameras specified in 6A203.a.2.;

4. Plug-ins specially designed for use with streak cameras which have modular structures and that enable the performance specifications in 6A203.a.1. or 6A203.a.2.;

5. Synchronizing electronics units, rotor assemblies consisting of turbines, mirrors and bearings specially designed for cameras specified in 6A203.a.1.;

b. Framing cameras, and specially designed components therefor, as follows:

1. Framing cameras with recording rates greater than 225 000 frames per second;

2. Framing cameras capable of 50 ns or less frame exposure time;

3. Framing tubes and solid-state imaging devices having a fast image gating (shutter) time of 50 ns or less specially designed for cameras specified in 6A203.b.1 or 6A203.b.2.;

4. Plug-ins specially designed for use with framing cameras which have modular structures and that enable the performance specifications in 6A203.b.1 or 6A203.b.2.;

5. Synchronizing electronics units, rotor assemblies consisting of turbines, mirrors and bearings specially designed for cameras specified in 6A203.b.1 or 6A203.b.2.;

c. Solid state or electron tube cameras, and specially designed components therefor, as follows:

1. Solid-state cameras or electron tube cameras with a fast image gating (shutter) time of 50 ns or less;

2. Solid-state imaging devices and image intensifiers tubes having a fast image gating (shutter) time of 50 ns or less specially designed for cameras specified in 6A203.c.1.;

3. Electro-optical shuttering devices (Kerr or Pockels cells) with a fast image gating (shutter) time of 50 ns or less;

4. Plug-ins specially designed for use with cameras which have modular structures and that enable the performance specifications in 6A203.c.1.

d. Radiation-hardened TV cameras, or lenses therefor, specially designed or rated as radiation hardened to withstand a total radiation dose greater than 50 x 10E3 Gy(silicon) (5 x 10E6 rad (silicon)) without operational degradation.

6A205 "Lasers", "laser" amplifiers and oscillators, other than those specified in 0B001.g.5., 0B001.h.6. and 6A005; as follows:

a. Argon ion "lasers" having both of the following characteristics:

1. Operating at wavelengths between 400 nm and 515 nm; and

2. An average output power greater than 40 W;

b. Tunable pulsed single-mode dye laser oscillators having all of the following characteristics:

1. Operating at wavelengths between 300 nm and 800 nm;

2. An average output power greater than 1 W;

3. A repetition rate greater than 1 kHz; and

4. Pulse width less than 100 ns;

c. Tunable pulsed dye laser amplifiers and oscillators, having all of the following characteristics:

1. Operating at wavelengths between 300 nm and 800 nm;

2. An average output power greater than 30 W;

3. A repetition rate greater than 1 kHz; and

4. Pulse width less than 100 ns;

d. Pulsed carbon dioxide "lasers" having all of the following characteristics:

1. Operating at wavelengths between 9000 nm and 11000 nm;

2. A repetition rate greater than 250 Hz;

3. An average output power greater than 500 W; and

4. Pulse width of less than 200 ns;

e. Para-hydrogen Raman shifters designed to operate at 16 μm output wavelength and at a repetition rate greater than 250 Hz;

f. Neodymium-doped (other than glass) "lasers" with an output wavelength between 1000 and 1100 nm having either of the following:

1. Pulse-excited and Q-switched with a pulse duration equal to or more than 1 ns, and having either of the following:

a. A single-transverse mode output with an average output power greater than 40 W; or

b. A multiple-transverse mode output having an average power greater than 50 W; or

2. Incorporating frequency doubling to give an output wavelength between 500 and 550 nm with an average output power of more than 40 W.

g. Pulsed carbon monoxide lasers, other than those specified in 6A005.d.2., having all of the following:

1. Operating at wavelengths between 5 000 and 6 000 nm;

2. A repetition rate greater than 250 Hz;

3. An average output power greater than 200 W; and

4. Pulse width of less than 200 ns.

6A225 Velocity interferometers for measuring velocities exceeding 1 km/s during time intervals of less than 10 microseconds.

6A226 Pressure sensors, as follows:

a. Shock pressure gauges capable of measuring pressures greater than 10 GPa, including gauges made with manganin, ytterbium, and polyvinylidene bifluoride (PVBF, PVF2);

b. Quartz pressure transducers for pressures greater than 10 GPa.

6B Test, Inspection and Production Equipment

6B004 Optical equipment as follows:

a. Equipment for measuring absolute reflectance to an "accuracy" of equal to or better than 0.1% of the reflectance value;

b. Equipment other than optical surface scattering measurement equipment, having an unobscured aperture of more than 10 cm, specially designed for the non-contact optical measurement of a non-planar optical surface figure (profile) to an "accuracy" of 2 nm or less (better) against the required profile.

6B007 Equipment to produce, align and calibrate land-based gravity meters with a static accuracy of better than 0,1 mGal.

6B008 Pulse radar cross-section measurement systems having transmit pulse widths of 100 ns or less, and specially designed components therefor.

6B108 Systems, other than those specified in 6B008, specially designed for radar cross section measurement usable for 'missiles' and their subsystems.

6C Materials

6C002 Optical sensor materials as follows:

a. Elemental tellurium (Te) of purity levels of 99,9995 % or more;

b. Single crystals (including epitaxial wafers) of any of the following:

1. Cadmium zinc telluride (CdZnTe), with zinc content of less than 6 % by 'mole fraction';

2. Cadmium telluride (CdTe) of any purity level; or

3. Mercury cadmium telluride (HgCdTe) of any purity level.

6C004 Optical materials as follows:

a. Zinc selenide (ZnSe) and zinc sulphide (ZnS) "substrate blanks", produced by the chemical vapour deposition process and having any of the following:

1. A volume greater than 100 cm³; or

2. A diameter greater than 80 mm and a thickness of 20 mm or more;

b. Electro-optic materials and non-linear optical materials, as follows:

1. Potassium titanyl arsenate (KTA) (CAS 59400-80-5);

2. Silver gallium selenide (AgGaSe2 , also known as AGSE) (CAS 12002-67-4);

3. Thallium arsenic selenide (Tl3AsSe3 , also known as TAS) (CAS 16142-89-5);

4. Zinc germanium phosphide (ZnGeP2, also known as ZGP, zinc germanium biphosphide or zinc germanium diphosphide); or

5. Gallium selenide (GaSe) (CAS 12024-11-2);

c. Non-linear optical materials, other than those specified in 6C004.b., having any of the following:

1. Third order susceptibility (chi 3) of 10E-6 m²/V² or more; and

2. A response time of less than 1 ms;

1. Having all of the following: a. Dynamic (also known as non-stationary) third order non-linear susceptibility (χ(3), chi 3) of 10-6 m2/V2 or more; and b. Response time of less than 1 ms; or

2. Second order non-linear susceptibility (χ(²), chi 2) of 3,3×10E-11 m/V or more;

d. "Substrate blanks" of silicon carbide or beryllium beryllium (Be/Be) deposited materials, exceeding 300 mm in diameter or major axis length;

e. Glass, including fused silica, phosphate glass, fluorophosphate glass, zirconium fluoride (ZrF 4 ) (CAS 7783-64-4) and hafnium fluoride (HfF 4 ) (CAS 13709-52-9) and having all of the following:

1. A hydroxyl ion (OH-) concentration of less than 5 ppm;

2. Integrated metallic purity levels of less than 1 ppm; and

3. High homogeneity (index of refraction variance) less than 5 × 10E-6;

f. Synthetically produced diamond material with an absorption of less than 10E-5 cm-¹ for wavelengths exceeding 200 nm but not exceeding 14 000 nm.

6C005 "Laser" materials as follows:

a. Synthetic crystalline "laser" host material in unfinished form as follows:

1. Titanium doped sapphire;

2. Not used.

b. Rare-earth-metal doped double-clad fibres having any of the following:

1. Nominal "laser" wavelength of 975 nm to 1 150 nm and having all of the following:

a. Average core diameter equal to or greater than 25 µm; and

b. Core 'Numerical Aperture' ('NA') less than 0,065; or

2. Nominal "laser" wavelength exceeding 1 530 nm and having all of the following:

a. Average core diameter equal to or greater than 20 µm; and

b. Core 'NA' less than 0,1.

6D Software

6D001 "Software" specially designed for the "development" or "production" of equipment specified in 6A004, 6A005, 6A008 or 6B008.

6D002 "Software" specially designed for the "use" of equipment specified in 6A002.b., 6A008 or 6B008.

6D003 Other "software" as follows:

a. "Software" as follows:

1. "Software" specially designed for acoustic beam forming for the "real time processing" of acoustic data for passive reception using towed hydrophone arrays;

2. "Source code" for the "real time processing" of acoustic data for passive reception using towed hydrophone arrays;

3. "Software" specially designed for acoustic beam forming for "real time processing" of acoustic data for passive reception using bottom or bay cable systems;

4. "Source code" for "real time processing" of acoustic data for passive reception using bottom or bay cable systems;

5. “Software” or “source code”, specially designed for all of the following:

a. “Real-time processing” of acoustic data from sonar systems specified by 6A001.a.1.e.; and

b. Automatically detecting, classifying and determining the location of divers or

b. Not used;

c. "Software" designed or modified for cameras incorporating "focal plane arrays" specified in 6A002.a.3.f. and designed or modified to remove a frame rate restriction and allow the camera to exceed the frame rate specified in 6A003.b.4. Note 3.a.

d. Software" specially designed to maintain the alignment and phasing of segmented mirror systems consisting of mirror segments having a diameter or major axis length equal to or larger than 1 m;

e. Not used;

f. "Software" as follows:

1. "Software" specially designed for magnetic and electric field "compensation systems" for magnetic sensors designed to operate on mobile platforms;

2. "Software" specially designed for magnetic and electric field anomaly detection on mobile platforms;

3. “Software” specially designed for “real-time processing” of electromagnetic data using underwater electromagnetic receivers specified by 6A006.e.;

4. “Source code” for “real-time processing” of electromagnetic data using underwater electromagnetic receivers specified by 6A006.e;

g. "Software" specially designed to correct motional influences of gravity meters or gravity gradiometers;

h. "Software" as follows:

1. Air Traffic Control (ATC) “software” application “programmes” designed to be hosted on general purpose computers located at Air Traffic Control centres and capable of accepting radar target data from more than four primary radars;

2. "Software" for the design or "production" of radomes and having all of the following:

a. Specially designed to protect the "electronically steerable phased array antennae" specified in 6A008.e.; and

b. Resulting in an antenna pattern having an 'average side lobe level' more than 40 dB below the peak of the main beam level.

6D102 "Software" specially designed or modified for the "use" of goods specified in 6A108.

6D103 "Software" which processes post-flight, recorded data, enabling determination of vehicle position throughout its flight path, specially designed or modified for 'missiles'.

6D203 "Software" specially designed to enhance or release the performance of cameras or imaging devices to meet the characteristics of 6A203.a. to 6A203.c.

6E Technology

6E001 "Technology" according to the General Technology Note for the "development" of equipment, materials or "software" specified in 6A, 6B, 6C or 6D.

6E002 "Technology" according to the General Technology Note for the "production" of equipment or materials specified in 6A, 6B or 6C.

6E003 Other "technology" as follows:

a. "Technology" as follows:

1. Optical surface coating and treatment “technology”, “required” to achieve an ‘optical thickness’ uniformity of 99,5 % or better for optical coatings 500 mm or more in diameter or major axis length and with a total loss (absorption and scatter) of less than 5 × 10E–3 ;

2. Optical fabrication "technology" using single point diamond turning techniques to produce surface finish "accuracies" of better than 10 nm rms on non-planar surfaces exceeding 0,5 m2;

b. "Technology" "required" for the "development", "production" or "use" of specially designed diagnostic instruments or targets in test facilities for "SHPL" testing or testing or evaluation of materials irradiated by "SHPL" beams;

6E101 "Technology" according to the General Technology Note for the "use" of equipment or "software" specified in 6A002, 6A007.b. and c., 6A008, 6A102, 6A107, 6A108, 6B108, 6D102 or 6D103.

6E201 "Technology" according to the General Technology Note for the "use" of equipment specified in 6A003, 6A005.a.2., 6A005.b.2., 6A005.b.3., 6A005.b.4., 6A005.b.6., 6A005.c.2., 6A005.d.3.c., 6A005.d.4.c., 6A202, 6A203, 6A205, 6A225 or 6A226.

6E203 "Technology", in the form of codes or keys, to enhance or release the performance of cameras or imaging devices to meet the characteristics of 6A203a. To 6A203.c.

General Notes

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Definition of Terms

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Images

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Reasons for Control

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CN Codes

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